1.   Patented 3D micro-structure Thermal solution adapted, outstanding heat dispersion under very low water flow.
2.   Supports most CPU like Intel I7& AMD Phenom II processors.
3.   The universal & strengthened backplate not only prevents MB distortion but also has high compatibility for all kinds of MBs.
4.  Easy installation due to 2-way tubing design which also enables upgrade to series connection of more water blocks.

5.  Highly polished base to ensure excellent surface contact with heat source.

6. Changable thread for upgrade to bigger tubing fitting

• Dimension：(D)45mm x (H)29mm
• Tubing Size：(OD)8mm x (ID)6mm
• Weight：180g
• Material：Pure Copper 

Technical Data

1：Thermal Resistance values varied by different test equipments. 2︰Heat Source Area：10x20mm² ;Heating Power：150W Flow Rate (ml/min) Thermal Resistance (℃/W) Pressure Drop (m-H2O) 100 0.2150 0.08 200 0.1764 0.10 300 0.1584 0.12 400 0.1480 0.16 500 0.1410 0.20 600 0.1356 0.25 700 0.1307 0.31 800 0.1278 0.38 900 0.1257 0.45 1000 0.1230 0.54